In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
在3d - MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
SMU module adopts the clock-gating method was applied to the survivor path storage block, reduce the survivor path storage memory power dissipation effectively.
在幸存路径管理模块采用门控时钟的方法，有效地降低了对幸存路径存储部分的功耗。
The invention provides an assembly fixture for a heat dissipation module, which is used for assembling the heat dissipation module on a circuit board.
本发明提供一种散热模组组装治具，其用于将散热模组组装于电路板上。
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